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ProSys MEMS Process Applications

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Better results and shorter cycle times
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ProSys Megasoncis can improve the efficacy and reduce cycle times in many unique MEMS process steps, both batch and single wafer.
Our customers achieve better results, often with shorter process cycles.
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Some examples:
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Thick photoresist develop completed in minutes, including fabrication of 1:23 HAR structures (as reported here)
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Photoresist strip at 65% faster strip rate (here)
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VIA cleaning of polymer residues (paper on request)
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Pre-bond cleaning reaching 98+% PRE of particles as small as 20 nm (here)
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Batch processing systems with a uniform sonic field that improve device yield & reliability while lowering cost-of-ownership (here)
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Better metal lift-off process
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We’ve also supported the development of an improved metal lift-off process with OEM partners. This green process uses DMSO and DIW in place of NMP and acetone. Complete metal removal is achieved without damaging sensitive structures.
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Contact us to explore how we can help with your specific cleaning or processing challenges.
     
 
Quick Response

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Contact us to discuss how ProSys Megasonics can help with your MEMS cleaning or processing challenges.
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